Wire Cut Service

MAYZULA SEAL

Wire Cut Service

Wire Cut Service is a precision machining technology based on the principle of Electrical Discharge Machining (EDM). It uses thin metal wires (typically molybdenum wire or brass wire) as electrodes. Through a numerical control system, it controls the tiny discharge gap between the electrode wire and the workpiece, and utilizes the thermal effect generated by high-frequency pulse current to erode materials layer by layer, achieving cutting.

Ultra-high Precision

Tolerances: ±0.0002″ (0.005mm)
CNC-controlled wire electrode for micron-level accuracy

History Emphasis

Non-contact EDM machining
Processes carbide, titanium, ceramics (high-hardness/high-melting-point materials)

Economic Outcomes

Programmable 2D/3D contours
No specialized tooling required for hollow/angled/intricate geometries

Mold Industry

Wire cut is a key technology in mold manufacturing. It can cut tool steel and carbide with high precision, accurately shaping mold cavities and cores. Its micron - level accuracy ensures consistent mold production, and non - contact machining prevents mold deformation, extending service life.

Aerospace Industry

Wire cut is used to machine aerospace materials like titanium alloys, manufacturing critical components such as engine blades. Through CNC programming, it achieves complex surface machining, ensuring lightweight and high - strength parts, thus safeguarding spacecraft operation.

Manufacturing Industry

With high precision and material adaptability, Wire cut enhances production efficiency and quality. It can machine various metals and special materials, precisely cutting complex contours and precision components via CNC programming, reducing errors from tool wear and accelerating production.

Electronics Industry

Wire cut meets the miniaturization needs of the electronics industry. It can machine ultra - thin circuit boards, micro connectors, and semiconductor packaging molds, precisely controlling dimensions. Its flexible machining of irregular shapes supports the lightweight design of electronic devices.